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How Huawei’s new FusionPower2.0 UPS addresses power density and heat dissipation

How Huawei’s new FusionPower2.0 UPS addresses power density and heat dissipation

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Organisations across the Middle East are increasingly looking to technology such as AI and IoT to optimise processes as they digitalise. This means the data centres that power these operations are expanding at an unprecedented rate. Guolingbing (Jake Guo), Data Centre Solution Manager, Huawei ME, tells us how Huawei’s FusionPower2.0 is helping to address some of the primary network challenges facing businesses in the region.

As Middle East organisations increasingly turn to AI, Big Data, cloud and IoT to optimise processes, the data centres that power these operations are expanding at an unprecedented rate. Huawei has recently updated its own UPS power module lineup with the launch of the new FusionPower2.0, a solution that addresses some of the primary network challenges facing businesses in the region.

To start, the FusionPower2.0 enables the power density of a single module to reach 100 kW/3 U, which is twice the industry standard. Based on the 100 kW module, the UPS achieves the ‘one megawatt, one cabinet’ principle, with a footprint that is more than halved compared with the traditional end-to-end parallel solution. The power supply and distribution system leave more space for data centre cabinets, enabling customers to increase revenue.

Yet cooling such high-density data centres is a constant challenge, aggravated by the extreme climatic conditions in the region. The Huawei 100 kW UPS power module design employs the U-shaped symmetric architecture, incorporating a wide range of heat dissipation and an optimal module layout. The symmetric architecture features a combination of small air resistance and fast heat dissipation. In addition, extended ventilation channels have made it possible to achieve wide-range heat dissipation. Furthermore, closely coupled cooling eliminates hotspot concentrations.

Due to the optimised heat dissipation design, Huawei UPS systems can function at 40°C for extended periods without derating. While patented innovative components further improve the heat dissipation capability, grooves on the heat sink enhance the convective heat transfer coefficient, improving heat dissipation by 10%. Furthermore, patented inductors with vertical windings improve winding heat dissipation by 50%. Compared with an aluminum heat sink, the patented multi-cavity redundant vapor chamber increases heat dissipation by 20%. In addition, proper matching between fans and air channels and a refined air volume control together significantly improve the heat dissipation efficiency of fans.

To arrive at this design, Huawei leveraged the multi-physical-field simulation platform at the Thermal Lab of the Huawei Laboratories. 

Huawei engineers utilise advanced software through simulation to predict the airspeed and temperature field of UPS components, boards and systems. The software creates an optimal model for module layout, air channel design, and fan selection, guiding PCB and structure design. While maintaining verification and optimisation levels, the embryo solution has developed into an optimal heat dissipation solution. The simulation platform is efficient and generates optimal results because it does not include processes standard in traditional thermal design, such as manual estimation, verification, modification and re-verification.

The multi-physical-field simulation platform boasts a precision level that is 30% higher than the industry standard. Temperature increase simulation for rectifiers and inverters is conducted in three fields: electromagnetic (electromagnetic compatibility and signal integrity), temperature (air volume, airspeed, and temperature rise) and stress field (electrical and mechanical). Powerful computing based on the simulation achieves the optimal layout of auxiliary systems and modules under various constraints. In addition, high-precision mock-up and simulation facilitate a refined heat dissipation design and the internal modelling of components (chips and semiconductors) supports precise thermal flow density design for internal crystal elements of insulated gate bipolar transistors (IGBTs). 

With this in mind, Huawei leverages extensive temperature sampling and data computing to control heat dissipation at all possible points. All components are tested under all working conditions. In addition, the IGBTs, inductors, diodes and bus capacitors support a large temperature margin.

In Huawei’s own words, every technical innovation must ultimately meet customer demands. Investments in emerging technology – represented in solutions like the FusionPower2.0 – aim to deliver a better customer experience while promoting business success.

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