Intel has announced that it has selected an area near Wrocław, Poland, as the site of a new cutting-edge semiconductor assembly and test facility. This facility will help meet critical demand for assembly and test capacity that Intel anticipates by 2027. Intel expects to invest up to US$4.6 billion in the facility, which will have the capacity to expand. When completed, the facility will support approximately 2,000 Intel employees. The construction of the facility is also expected to create several thousand more jobs, in addition to eventual hiring by suppliers. Design and planning for the facility will begin immediately, with construction to commence pending European Commission approval.
Intel’s planned investment in Poland, combined with its existing wafer fabrication facility in Leixlip, Ireland, and its planned wafer fabrication facility in Magdeburg, Germany, will help create a first-of-its-kind end-to-end leading-edge semiconductor manufacturing value chain in Europe. It will also serve as a catalyst for additional ecosystem investments and innovation in Poland and across the European Union.
“Poland is already home to Intel operations and is well positioned to work with Intel sites in Germany and Ireland,” said Pat Gelsinger, CEO, Intel. “It is also very cost-competitive with other manufacturing locations globally and offers a great talent base that we are excited to help to grow. We’re grateful for the support from Poland as we work to grow the local semiconductor ecosystem and contribute to the EU’s goal of creating a more resilient and sustainable semiconductor supply chain.”
Mateusz Morawiecki, Prime Minister of Poland, commented: “We are pleased that the largest greenfield investment in the history of Poland is being led by Intel, a Silicon Valley legend known for its innovation. Chips and semiconductors are critical technologies in the 21st century and we are excited to expand Poland’s role in the global semiconductor supply chain and help to establish the country as an economic trendsetter.”
Poland was chosen as the location for the new site for several reasons, including its infrastructure, strong talent base and excellent business environment. The new site is also well positioned to work with Intel’s leading-edge wafer fabrication site planned for Germany and its existing leading-edge wafer fabrication site in Ireland. This proximity will enable close collaboration between the three manufacturing sites and help increase resilience and cost efficiency of the European semiconductor supply chain.
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