EnSilica, a leading turnkey supplier of mixed-signal ASICs and SoCs, has announced it is to supply VITES with a new beamformer chip for satellite user terminals. VITES will use the chip at the heart of its new ViSAT-Ka-band terminal.
EnSilica’s beamforming chip is optimised to enable VITES’s creation of power- and cost-efficient ground-based flat panel user terminals for satellite communication systems that can be used across a range of fixed and SatCom on the move (SOTM) applications.
VITES specialises in broadband wireless systems for professional applications and has been delivering flat panel terminals based on its own phased array technology since 2019. Its new ViSAT-Ka-band terminal is intended to be integrated into vehicles for Communications-on-the-Move applications. As such it can track the movement of low earth orbit (LEO) and other non-geo synchronous (NGSO) satellites and allows users to access high-speed connectivity anywhere on the planet while the vehicle is moving.
ViSAT-Ka uses an innovative scalable architecture that enables extremely power-efficient TDD and FDD terminals at affordable prices. On this advanced technical base, VITES is developing terminals for both land-based and maritime vehicles of any kind, including for cost and power-sensitive automotive applications.
This means that vehicles can access ‘always on’ broadband connections outside of 4G/5G network coverage areas with high throughput and in an ultra-compact form factor that allows for both retro and line fitting.
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